MSP75Peelable masking product

  • MSP75 PEELABLE MASKING

    MSP75 is a masking product which can be used when it is necessary to protect from solder. It is therefore extremely useful and
    advantageous in the soldering of printed circuits on automatic solder machines.

    • METHOD OF USE

      • • Apply a thin coat of MSP/75
      • • Allow to polymerise at room temperature for approximately 60 mm
      • • Proceed with soldering
      • • When the printed circuit board is cold, peel off the MSP/75.

      In the event of dry oven polymerisation, the temperature should not exceed 60° C for a maximum period of 48 hours.

    • PACKAGING

      • • 250 or 500 ml plastic bottles
      • • For other capacities : consult us
      • ColourWhite
      • Dry extract55 - 60 %
      • Viscosity46,5 à 51 Pa.s
      • pH9 à 11
      • Solubility in water before polymerisation
      • Polymerisation 60 mm (room temperature) according to deposit thickness
    • APPLICATION

      MSP/75 represents a simple, rapid and effective manner of masking temporarily and locally areas which are not to be soldered on printed
      circuits e.g. hardware, inserts, conductors, etc. MSP/75 is easily removed by peeling without leaving any trace after soldering or cleaning.

      SHELF LIFE

      6 months.

    STORAGE

    Minimum temperature: 10° C
    Maximum temperature: 30° C