MSP75 is a masking product which can be used when it is necessary to protect from solder. It is therefore extremely useful and
advantageous in the soldering of printed circuits on automatic solder machines.
In the event of dry oven polymerisation, the temperature should not exceed 60° C for a maximum period of 48 hours.
|• Dry extract||55 - 60 %|
|• Viscosity||46,5 à 51 Pa.s|
|• pH||9 à 11|
|• Solubility in water before polymerisation|
|• Polymerisation 60 mm (room temperature) according to deposit thickness|
MSP/75 represents a simple, rapid and effective manner of masking temporarily and locally areas which are not to be soldered on printed
circuits e.g. hardware, inserts, conductors, etc. MSP/75 is easily removed by peeling without leaving any trace after soldering or cleaning.
Minimum temperature: 10° C
Maximum temperature: 30° C