Solder paste E430Specifically formulated to work with lead-free alloy

  • SOLDER PASTE E430

    The E430 solder paste has been specifically formulated to work with lead-free alloy.For your composition ensures excellent wetting in the solder without fillets or defects and obtained a very shiny surface and very smooth solder joints. This is due to a more effective flux composition ,with lighter residues,allowing all in-circuit test without preacleaning.

    FEATURES

    AlloySAC305 (Sn99,5Ag3Cu0,5)
    Melting point217ºC.
    Granulometry25-45µm type 3
    Clasification J-STD-004ROLO.
    Porcentage flux11,50
    Porcentage of metal88,50
    Halogen0
    Viscosity190 (Pa.S)
    BellcoreGR-78-CORE
    Self live6 months (0-10ºC)

     

    PROPERTIES

    • Good stability in stencil without changes of viscosity after several printing cycles.
    • Lack of solderballing and voids in solder CSP/BGA.
    • Excellent solder for ultra fine-pich components 0,25mm.
    • Keeps its viscosity stable at high print speeds 150mm/sec.
    • Goods solder in circuits different finishes,metallic,Ni/Au and Ag chemical tin.

     

    REFLOW PROFILE E430

    • Preheat: 120-180ºC
      Time: 60 a 120sec.
      The increased temperature of order of 1,5 to 3ºC/sec. allowing activate the flux and approaching the fusion temperature of 217ºC.
    • Reflow: 217ºC. max. 60sec.
    • Peak temperature: 238-254ºC.
      Time over 220ºC of 30 to 40sec.
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